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Bulletin of the Korean Chemical Society (BKCS)

ISSN 0253-2964(Print)
ISSN 1229-5949(Online)
Volume 35, Number 1
BKCSDE 35(1)
January 20, 2014

Title	Copper Electrode Material using Copper Formate-Bicarbonate Complex for Printed Electronics
Author	Jaeeun Hwang, Sinhee Kim, Kevin Ray Ayag, Hongdoo Kim*
Keywords	Copper electrode material, Copper formate complex, Printed electronics
Abstract	Copper ink has been prepared by mixing copper(II) formate and 2-ethyl-1-hexylammonium bicarbonate (EHABC) to overcome some weak points such as aggregation and degradation of copper nano-type ink. Ink was coated on glass substrate and calcined at 110 oC to 150 oC to generate electrically conductive copper film under two different atmospheres such as nitrogen gas and gaseous mixture of formic acid and methanol. The lowest resistivity of 1.88 ·cm of copper film was obtained at 150 oC in gaseous formic acid condition. The long-term resistivity shows to increase from 1.88 ·cm to 2.61 ·cm after one month.
Page	147 - 150
Full Text	PDF

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