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Bulletin of the Korean Chemical Society (BKCS)

ISSN 0253-2964(Print)
ISSN 1229-5949(Online)
Volume 35, Number 10
BKCSDE 35(10)
October 20, 2014 

 
Title
High-temperature Adhesion Promoter Based on (3-Glycidoxypropyl) Trimethoxysilane for Cu Paste
Author
Jianwei Jiang, Yong Hwan Koo, Hye Won Kim, Ji Hyun Park, Hyun Suk Kang, Byung Cheol Lee*, Sang-Ho Kim*, Hee-eun Song*, Longhai Piao*
Keywords
Printed electronics, High-temperature adhesion promoter, Cu paste, (3-Glycidoxypropyl) trimethoxysilane
Abstract
To realize copper-based electrode materials for printed electronics applications, it is necessary to improve the adhesion strength between conductive lines and the substrate. Here, we report the preparation of Cu pastes using (3-glycidoxypropyl) trimethoxysilane (GPTMS) prepolymer as an adhesion promoter (AP). The Cu pastes were screen-printed on glass and polyimide (PI) substrates and sintered at high temperatures (> 250 oC) under a formic acid/N2 environment. According to the adhesion strengths and electrical conductivities of the sintered Cu films, the optimized Cu paste was composed of 1.0 wt % GPTMS prepolymer, 83.6 wt % Cu powder and 15.4 wt % vehicle. After sintering at 400 oC on a glass substrate and 275 oC on a PI substrate, the Cu films showed the sheet resistances of 10.0 mΩ/sq. and 5.2 mΩ/sq., respectively. Furthermore, the sintered Cu films exhibit excellent adhesion properties according to the results of the ASTM-D3359 standard test.
Page
3025 - 3029
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