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Electrochemical Determination of As(III) at Nanoporous Gold Electrodes with Controlled Surface Area


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FigureS1.

(a) Cyclic voltammograms of NPG electrodes according to reaction time in 0.1 M H2SO4 at a scan rate of 50 mV s-1. (b) Dependence of Rf value of NPG electrodes upon the reaction time. NPG electrodes prepared by anodization in 0.1 M phosphate buffers (pH 8) containing 1 M KCl. (c) SEM image of typical NPG layers prepared by anodization.

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FigureS2.

(a) and (b) SWV response on NPG electrodes with different surface area in 3 μM As(III) + 1.0 M H2SO4. (c) Comparison of blank SWV responses of NPG electrodes in 1.0 M H2SO4 in the absence of As(III).

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FigureS3.

SWV obtained on NPG (50 s) electrodes in 1 M HCl containing 5 μM As(III) at various deposition potentials. Predeposition time = 150 s.

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FigureS4.

SWVs obtained on a flat Au electrodes in 1 M HCl containing various concentrations of As(III) at different pre-deposition times.

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TableS1.

Dependence upon the deposition time of sensitivity on flat Au electrode and NPG (50 s)

Deposition Time (s) Electrode Sensitivity (μA/μM) NPG (50 s)/Flat Au sensitivity
50 Flat Au 1.12 1.79
NPG (50 s) 2.01
150 Flat Au 2.60 3.16
NPG (50 s) 8.21
400 Flat Au 1.96 11.3
NPG (50 s) 22.2
FigureS5.

(a) SWVs obtained on flat Au electrodes in 1 M HCl containing various concentrations of As(III) in the presence of 5 μM Cu(II). Deposition potential = -0.2 V and pre-deposition time = 150 s. (b) Calibration curves of As detection in the presence and absence of Cu(II).

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FigureS6.

SWVs obtained on (a) flat Au and (b) NPG (50 s) electrodes for 5 μM As(III) in the presence of 1 ~ 5 μM Cu(II) in 1.0 M HCl. Deposition potential = −0.2 V and pre-deposition time = 150 s.

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